From Test Protection to High‑Density Interconnection – Qstar‑Link Presents Two Solution Matrices at CIOE 2026

Classification：Company News Release time：2026-09-02 13:55:50 Author: Source:

Qstar‑Link, a provider of high‑performance fiber optic connectivity and testing solutions, will showcase its two solution matrices at Booth 12C700/12C701 during the show.

September 9–11, 2026 – The 27th China International Optoelectronic Exposition (CIOE 2026) will be held at the Shenzhen World Exhibition & Convention Center (Bao’an New Venue). As a bellwether event for the global optoelectronics industry, this year’s edition brings together over 4,000 leading companies from more than 30 countries and regions. Running concurrently with the IICIE (International Integrated Circuit Innovation Expo) and elexcon Shenzhen Electronics & Embedded Exhibition, the three shows form a “triple‑exhibition” platform covering 320,000 square metres of exhibition space, with over 5,000 exhibitors and an expected 240,000+ professional visitors.

Qstar‑Link, a provider of high‑performance fiber optic connectivity and testing solutions, will showcase its two solution matrices at Booth 12C700/12C701 during the show.

Portfolio 1 – Optical Transceiver Testing Series

As 800G optical transceivers enter mass production and the 1.6T era accelerates, the R&D and production testing of optical transceivers impose unprecedented demands on connection reliability, mating durability, and measurement precision. Qstar‑Link focuses on optical transceiver testing scenarios, with “precision testing” at its core. Built around two technological pillars – physical port protection and non‑contact optical connection – the company has developed a complete “port extension” testing solution framework.

□OES (Optical Extension Shield) Series – Physical Port Protection

Based on a “gap‑based physical isolation” design philosophy, the innovative port extension architecture physically isolates the precision test ports of optical transceivers from test equipment, effectively transferring mating wear, dust contamination, and other degradation factors to low‑cost, quickly replaceable protective components. After market introduction, the solution has been upgraded to its 2.0 generation with a push‑pull boot design, incorporating customer feedback.

MPO OES 2.0 – Designed for high‑speed optical transceiver testing with MPO interfaces, it extends port mating life by 3‑5 times and reduces end‑face damage rates to below 0.5%. It deeply covers 400G/800G/1.6T high‑speed optical transceiver mass‑production test scenarios and has passed verification by multiple leading industry customers, with stable volume orders in place. The upgraded push‑pull boot structure on this 2.0 version ensures smoother insertion/withdrawal, more stable performance, and improved production efficiency.
LC OES 2.0 – Equipped with a push‑pull boot, this solution is tailored for LC‑interface high‑speed optical transceivers and single‑fiber optical device testing. It extends LC port mating life by more than 4 times and is compatible with 10G/25G/100G/400G LC‑interface optical transceivers and optical transceivers, filling the market gap for single‑fiber port protection.

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□Non‑Contact Test Cable Series – A Comprehensive Strategic Direction

Beyond the port‑extension approach of the OES series, Qstar‑Link has closely followed market trends in port applications and collaborated with multiple partners to diversify its test cable portfolio. This series employs a non‑contact end‑face design, fundamentally eliminating end‑face wear and contamination that occur with traditional contact connectors during high‑frequency mating – a forward‑looking strategic deployment in the optical transceiver testing field.

Non‑Contact ELSFP Test Cable – Designed for NPO/CPO (co‑packaged optics) external laser applications, compliant with the OIF ELSFP standard, supporting blind‑mate optical connections and providing highly reliable test connectivity for continuous‑wave optical transmission between external lasers and optical transceivers.
Non‑Contact MMC Test Cable – MMC is a next‑generation VSFF (very small form factor) multi‑fiber connector offering up to 3× the port density of traditional MPO, suitable for high‑density testing of 128‑port and above switches.
Non‑Contact SN‑MT Test Cable – Combining the compactness of SN duplex connectors with the multi‑fiber integration of MT ferrules, this cable is ideal for batch aging and performance screening tests of high‑speed optical transceivers.

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Portfolio 2 – High‑Density Optical Interconnection: FA, PM, and Multi‑Core Fiber Assemblies

To address the ever‑increasing bandwidth density and transmission capacity demands in AI clusters, data centres, and intra‑optical‑module interconnects, Qstar‑Link offers a high‑density optical interconnection solution covering three product lines: Fiber Arrays (FA), Polarization‑Maintaining (PM) fiber assemblies, and Multi‑Core Fiber (MCF) assemblies.

2D Fiber Array (2D FA) – Features high‑precision V‑groove array design, supporting ultra‑fine pitch (≤127 μm) fiber placement with excellent positional accuracy and low insertion‑loss consistency. Widely used in optical engine modules, WDM devices, and silicon photonic coupling.
Polarization‑Maintaining Fiber Assemblies – Utilise high‑extinction‑ratio PM fibers, suitable for coherent optical transceivers, fiber optic gyroscopes, and precision sensing applications, ensuring stable polarisation transmission and phase retention under harsh environments.
Multi‑Core Fiber Assemblies – Based on spatial‑division multiplexing technology, a single fiber integrates multiple independent cores, increasing transmission capacity by 3‑4 times, providing high‑density, high‑capacity, low‑loss optical interconnection for data centres, AI clusters, and high‑speed optical transceivers.

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Testing Solutions as the Anchor, High‑Density Interconnection as the Extension

From optical transceiver test port protection and non‑contact optical connections to high‑density optical interconnect components, Qstar‑Link has established a complete dual‑matrix portfolio – “Optical Transceiver Testing + High‑Density Optical Interconnection” – covering the entire chain from R&D validation and production testing to system‑level interconnection of optical transceivers.

We Cordially Invite You to Join Us – Let’s Shape the Future of Optical Connectivity

Founded in 2019, Qstar‑Link is dedicated to the optical transceiver testing domain, delivering high‑performance, highly reliable professional testing solutions. Our core team brings over 20 years of deep experience in the optical communications industry, with thorough knowledge of optical transceiver manufacturing processes, testing standards, and application requirements. We continuously focus on testing technology innovation, helping customers enhance product quality and production efficiency through stable performance, a rigorous testing system, and mature solutions. Supported by advanced manufacturing and verification equipment, a quality supply chain, and a complete production‑inspection‑delivery system, we ensure dependable product and service quality.

From September 9 to 11, 2026, we warmly welcome friends from all sectors to visit Booth 12C700/12C701 at the Shenzhen World Exhibition & Convention Center (Bao’an New Venue) to experience our two solution matrices firsthand and explore cooperation opportunities.

Empowering optical transceivers ultimate performance with precision testing solutions !